Bond strength repair of a bulk-fill composite using different adhesive systems and resin composites
نویسندگان
چکیده
In this study evaluated the effect of different adhesive systems and resin composites on microtensile bond strength repairs using a bulk-fill composite. Ninety specimens were prepared half-hourglass mold composite Filtek Bulk Fill silicone matrix. Specimens randomly distributed in 9 experimental groups (n=10) according to [Universal Single Bond (SBU), Scotchbond Multipurpose Adhesive (SBMP), 2 (SB2)] (Filtek Fill, Aura Z250). For control group, hourglass used measure ultimate strength. submitted thermal cycling (5,000 cycles, 5 55°C, 30s) simulate aging restoration then repair procedure was performed. After diamond-tipped surface roughening be repaired, protocol performed specimen placed an hourglass-shaped other half filled with 24h, obtained by universal testing machine at speed 0.5mm/min. Data statistically analyzed two-way ANOVA, Tukey’s Dunnett’s tests (α=0.05). SBU showed higher compared SB2, while SBMP intermediate values. However, all lower conclusion, or conventional solvent-free improved adhesion independent tested.
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ژورنال
عنوان ژورنال: Research, Society and Development
سال: 2021
ISSN: ['2525-3409']
DOI: https://doi.org/10.33448/rsd-v10i5.14951